Aluminium Copper Clad Laminates are advanced composite materials engineered for high-performance electronic and thermal applications. These laminates feature a robust aluminum base bonded with a layer of copper foil, offering excellent electrical conductivity, superior heat dissipation, and mechanical stability. Ideal for power electronics, LED lighting, and automotive circuits, they ensure reliable performance under high thermal and electrical loads. Their lightweight structure, corrosion resistance, and easy machinability make them a preferred choice in modern PCB manufacturing and industrial electronics.